|
Rigid PCB Capacity |
||
|
Items |
Mass production |
Sample |
|
Standard |
IPC Class II & III or specified by customer |
IPC Class II & III or specified by customer |
|
Material |
FR1, CEM-1, FR-4,Aluminum, high frequency (ROGERS, TEFLON, TACONIC) |
FR1, CEM-1, FR-4,Aluminum, high frequency (ROGERS, TEFLON, TACONIC) |
|
Layers number |
1-32 layers |
1-40 layers |
|
Max. Panel Size |
24"*32" ( 609mm*813mm ) |
24.5” × 47” ( 622mm ×1200mm ) |
|
Max. Board Thickness |
6mm |
8mm |
|
Min. Board Thickness |
0.4mm |
0.2mm |
|
Min. line width/spacing |
0.1/0.1mm(4/4mil) |
0.076/0.076mm(3/3mil) |
|
Min. Hole Size |
0.2mm(7.87mil) |
0.15mm(6mil) |
|
PTH Dia. Tolerance |
±0.076mm(±3mil） |
±0.05mm(±2mil） |
|
NPTH Dia. Tolerance |
±0.05mm(±2mil） |
±0.025mm(±1mil） |
|
Hole Position Deviation |
±0.076mm(±3mil） |
±0.05mm(±2mil） |
|
Max. Aspect ratio |
10:1 |
12:1 |
|
Heavy copper |
4 OZ (140um) |
6 OZ （210um） |
|
Hole wall copper thickness of PTH |
18-50um |
18-50um |
|
Surface Finished |
OSP,HASL,HASL(lead free),Gold Finger, ENIG, Immersion Silver, Immersion Tin |
OSP,HASL,HASL(lead free),Gold Finger, ENIG, Immersion Silver, Immersion Tin |
|
Max. solder mask or resin plug hole diameter |
0.6mm |
0.8mm |
|
Min. solder mask dam |
3mil |
3mil |
|
Solder Mask color(LPI) |
Green, Black, Blue, White, Yellow, Red |
Green, Black, Blue, White, Yellow, Red |
|
Silkscreen color |
White , Black |
White ,Black |
|
Outline |
Routing, V-CUT, Beveling, Punching |
Routing, V-CUT, Beveling ,Punching |
|
Outline Tolerance |
±0.13mm(±5mil) |
±0.1mm(±4mil) |
|
Peelable Mask |
Top, bottom, double Sided |
Top, bottom, double Sided |
|
Impedance Control |
±10% |
±8% |
|
Warp and Twist |
≤0.75% |
≤0.5% |
|
Flammability |
94V-0 |
94V-0 |
